Taconic to showcase multilayer capability at MTT-S IMS 2007

Released on = April 23, 2007, 10:40 am

Press Release Author = Taconic

Industry = Industrial

Press Release Summary = Taconic will feature a variety of unique products that offer
low loss and high reliability for conventional and multilayer RF and high speed
digital board fabrication at the MTT-S International Microwave Symposium

Press Release Body = Petersburgh, NY - April 2007 - The Advanced Dielectric Division
of Taconic will feature a variety of unique products that offer low loss and high
reliability for conventional and multilayer RF and high speed digital board
fabrication at the MTT-S International Microwave Symposium in Honolulu, HI June 5th
- 7th.

Taconic's TacPreg prepregs, constructed with BT epoxy/woven fiberglass/PTFE
components, offer reduced electrical loss and ease of fabrication for high speed
digital and RF commercial and military applications. These dimensionally stable
laminates, available with a Dk of 3.00 - 3.5, enable production of 20+ layer boards
at FR-4 laminating temperatures and pressures.

HyRelex thin flexible interconnect materials offer exceptional thermal, mechanical,
electrical and moisture resistant properties for multilayer, double sided and rigid
flex circuits. Low dissipation factor, excellent peel strength and smooth surface
profile make HyRelex ideal for applications involving high frequencies, high
temperatures and harsh environments.

TSM-30, designed for consistent performance over broad temperatures and frequencies,
offers the unique properties of both low loss and low moisture and solvent
absorption.

For heat dissipation in multilayer boards, Taconic's heavy metal clad laminates
provide thick layers of copper, brass and aluminum for reliability in temperature
management.

For nearly fifty years, Taconic has been an industry leader in the development of
advanced engineered composite materials for the global marketplace. The Company
offers a wide range of high frequency laminates and prepregs used for fabrication of
antennas, multilayer RF and high speed digital boards, interconnections and devices.

For more information regarding the Company's high performance materials, please
visit Taconic at IEEE MTT-S 2007 at the Hawaii Convention Center in Booth #1632 or
visit the Taconic Advanced Dielectric Division website at www.taconic-add.com.


Web Site = http://www.taconic-add.com

Contact Details = Taconic
136 Coonbrook Road
Petersburgh, NY 12138
518-658-3202

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